c0t0d0s0.org

Sounds pretty cool: A new technique to apply glue to processors and heat spreaders was invented by IBM research. Well, with a six gigahertz heat plate ("Power6. Will cook your meal in an instance") i would search for any fraction of a percent of gain in heat transportation, too . Liquid nitrogen is so expensive ...

But: What´s about processors that don´t need such an voodoo glue application method because their don´t produce so much heat? I have to admit that IBM marketing is quite capable to sell IBM´s weaknesses as their strengths.

No, a fan from HP. I´ve already reported about the new fan technology out of the HP labs. This is what you get, when you solve the cpu heat problem at wrong end. HP designed this beast of a fan.

It´s obvious you can find better solution. You can buy already one from Sun. The solution is called UltraSPARC T1

(via cuddletech and uadmin)